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 Side Panel

 

As of enhancement package 7, SP 09 for SAP ERP 6.0, SAP delivers CML specific side panel and Collaborative Human Interface Parts (CHIPs).

You use the side panel to display additional context-sensitive information that relates to the main application in a container by the side of the content area of SAP NetWeaver Business Client (NWBC).

Technical Details

Country Dependency

Valid for all countries

Software Component Version

EA-FINSERV 617

Application Component

FS-CML (Loans Management)

Available as of

SAP Enhancement Package 7 (SP09) for SAP ERP 6.0

Business View

NWBC_VS_GUI_TAG

CML Specific CHIPS

  • CHIP to display the Business Partners (BP), who are assigned to the CML loan. The CHIP supports the CML product categories 300 and 330. A customizing is provided, in order to determine the relevant roles (see Customizing section). The CHIP displays only data for BP that have one of the customized roles.

    The system picks the data for the CHIP from the following tables:

    • BUT000 - BP: General data

    • BP001 - Further (FS-specific) general attributes

    • BP1010 - Credit Standing Information

  • CHIP to display bank details and SEPA mandates for a BP for the product categories 300 and 330. CHIPs consider all bank details and all related SEPA mandate data for the concrete BP, who is assigned to the financial condition.

  • CHIP to display the first hierarchy level of BP relationships for the main borrower with selected attributes of the relationship. It supports the CML product categories 300 , 330 and 340. A customizing is provided, in order to determine the relevant relationship categories (see Customizing section).

  • CHIP to display open items (debit and credit) for the loan contract and the main borrower. The CHIP supports CML product categories 300, 330 and 340. The CHIP provides a link to the SAP ABAP backend transaction FBL5N (Customer Line Item Display) using which you can display the open item report for the main borrower.

  • CHIP to display all disbursements for the loan contract. The CHIP supports CML product categories 300, 330 and 340. It displays all disbursements for the concrete loan contract in a table – one row for each disbursement. It also displays reversed disbursements.

  • CHIP to display all loan contracts to which the collaterals of a loan are assigned. It supports the CML product categories 300 and 330. The CHIP offers hyperlinks to display the selected loan in a new tab.

  • CHIP to display all BPs to which the collateral of a loan are assigned. It supports the CML product categories 300 and 330. The CHIP offers hyperlinks to display the selected BP in a new tab.

  • CHIP to display all the loan contracts, which are assigned to the collateral objects in the Objects tab. The CHIP is attached to the main screen of the display and change transactions of CML contracts. It supports the CML product categories 300 and 330. The CHIP displays all loan contracts to which the collateral objects of a given loan are assigned. The CHIP offers hyperlinks to display the selected loan in a new tab.

  • CHIP to display the BPs, which are assigned to the collateral objects in the Objects tab. The CHIP is attached to the main screen of the display and change transactions of CML contracts. It supports the CML product categories 300 and 330. The CHIP displays all BPs to which the collateral objects of a given loan are assigned. The CHIP offers hyperlinks to display the selected BP in a new tab.

Customizing

  • Determine relevant roles for the business partner in Customizing Maintain BP Roles under Start of the navigation path SAP Banking Next navigation step Loans Management Next navigation step Settings for Side Panel End of the navigation path.

  • Determine relevant relationship categories in Customizing Maintain BP Relationship Categories under Start of the navigation path SAP Banking Next navigation step Loans Management Next navigation step Settings for Side Panel End of the navigation path

More Information

For more information, see SAP Note 2157704Information published on SAP site and 2159720Information published on SAP site.